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IPtronics cements its lead in parallel optical interconnect applications
IPtronics announces Flip Chip Technology
With the recent addition of solder bumped devices to the existing product line, IPtronics enables both wire bond solutions as well as flip chip 40 and 120 gigabit/s applications
Menlo Park, CA Feb 2009
IPtronics is pleased to announce availability of solder bumped solutions for flip chip applications of 40 and 120 gigabit/s parallel optical interconnects.
The solder bumped solutions from IPtronics enable high volume flip chip applications with better performance, lower cost and high density compared to traditional wire-bonding technology. Flip chip technology has been used extensively in consumer applications such as cell phones and laptop computers.
While wire-bonding is the technology of choice for prototyping and lower quantities, flip chip technology is geared for low cost, high capacity mass production. Better performance is achieved since less parasitics, reflections and noise are induced compared to the case with wire-bonds. Lower cost in production is achieved through a single standard reflow assembly process versus multiple wire bond operations - this even boosts module/OSA vendors' capacity drastically and high density is achieved through the fact that additional space for the wire-bonds are no longer needed.
IPtronics bases its solder bump solutions on an established flow with our partner, ST Microelectronics. This flow is easily scalable to very high volumes and is less costly than compression bump technology or stud bumps. The solder bumps are lead-free and ROHS compliant.
In order to be able to realize supply of 100's of millions of devices, all production has been outsourced to STMicroelectronics, a major semiconductor manufacturer and a leader of the relevant technology. STM has certified IPtronics as a design center based on a unique partnership agreement and will guarantee IPtronics' customers production capacity.
Jesper Bek, CEO IPtronics Inc says, "I am proud that IPtronics is taking yet another step forward in powering the parallel optical interconnect market. By enabling truly high volume and low cost applications, the industry has a real and present alternative to power hungry electrical interconnects and an opportunity for greener, more power efficient systems while adding more throughput"
IPtronics targets the 4 channel solutions at Infiniband DDR & QDR QSFP modules, Active Optical Cables, 40GBASE-SR4, video applications and proprietary solutions. The 12 channel solutions cater to SNAP12, CXP, and 100GBASE-SR10. IPtronics expects that the solder bump technology will be widely used in optical subassemblies, also known as optical engines, for the above applications.
These products are fully available. Future products bring even lower power as well applications for the consumer space.
The company operates from its headquarters in Roskilde, Denmark and its US operations, IPtronics Inc. based in Menlo Park, CA.
IPtronics will exhibit at OFC in San Diego March 24th - March 26th from booth 1429.